Corporate EVP / Head of Advanced Packaging · SAMSUNG-DSRA · company speakers →
Dr. KIM is currently working as Corporate EVP / Head of DSRA-AVP in San Jose, CA. SAMSUNG has launched a new business unit to support the need of the semiconductor industry's advanced packaging for high-performance systems. The name of the new business is AVP (Advanced Packaging). Prior to joining Samsung, he was system architect for Signal Integrity and Power Integrity at Apple, path-finding for leading-edge consumer computers. Previously, he was with Qualcomm as SI manager in Snapdragon packaging. Earlier than Qualcomm, he was with Wireless Business Unit of Texas Instruments as co-design engineer optimizing the electrical design of OMAP packages/systems. Before TI, he was with Rambus as SI engineer to design and analyze memory systems. Dr. Kim received Ph.D Degree in ECE at Georgia Tech in 2004 and M.S. & B.A. degrees from KAIST, Korea in 1999 and 1997.
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