Mike Li

Fellow · Intel · company speakers →

electronics-manufacturingcomponents-partstelecoms-5gautomotiveiot-smart-techartificial-intelligence

Is this you? Claim this profile →

No public contact links on file.

Speaking history

DesignCon

2 February 2027 Santa Clara, United States “Next Generation 224Gbps-PAM4 SERDES, Channel & Link Systems”

Heating Electrification Workshop

20 October 2026 Portland, United States “Accelerating Community Climate Progress with Federal Funds”

Drive World Conference & Expo

24 February 2026 Santa Clara, United States “224Gbps-PAM4 End-to-end Channel Solutions for High-density Networking System”

Topics this speaker covers

electronics-manufacturingcomponents-partstelecoms-5gautomotiveiot-smart-techartificial-intelligence

Sectors

manufacturing_industrialtransportation_logistics_supply_chain

Sourcing speakers for your event?

Browse the speaker directory →