Ivor Barber

Corporate Vice President of Packaging · AMD · company speakers →

Ivor Barber is Corporate Vice President of Packaging at AMD developing advanced package solutions with Chiplet Architecture in High Performance Computing, Graphics and Visualization Technologies. With over 40 years experience in the field of Semiconductor Packaging Ivor has held engineering and engineering management positions at National Semiconductor, Fairchild, VLSI Technology, LSI Logic and Xilinx. Ivor is a frequent panelist and presenter in packaging forums with deep experience in leading edge packaging solutions and high density interconnect technologies. Ivor has 20 published US patents in Semiconductor Package Manufacturing and Package Design and is a board member of MEPTEC. Ivor has a Bachelor of Science Degree in Manufacturing Technology from Napier University, Scotland, UK.

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