Hua Chen

R&D Engineer · Ansys · company speakers →

electronics-manufacturingcomponents-partstelecoms-5gautomotiveiot-smart-techartificial-intelligence

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Speaking history

DesignCon

2 February 2027 Santa Clara, United States “Security Integrity Analytics by Thermal Side-channel Simulation: An ML-augmented Auto-POI Approach”

Drive World Conference & Expo

24 February 2026 Santa Clara, United States “Security Integrity Analytics by Thermal Side-channel Simulation: An ML-augmented Auto-POI Approach”

Topics this speaker covers

electronics-manufacturingcomponents-partstelecoms-5gautomotiveiot-smart-techartificial-intelligence

Sectors

manufacturing_industrialtransportation_logistics_supply_chain

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