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B2B Event

LID World Summit 2026

Trade-orientedMid-size
📅 23 June 2026 – 25 June 📍 Maison Minatec, Grenoble, FR ↗ 🏢 CEA-Leti

1,250

Attendees

CEA-Leti's 2-day summit in Grenoble focusing on microelectronics, photonics, and AI, featuring 30+ live demos, 160+ speakers, and 1,250 attendees from the semiconductor, automotive, and healthcare industries.

Exhibitor mix: 30+ live demos, start-ups corner, and partner booths.

Planning for next year?

Dozens of solution providers here. You probably care about 20–30. Tell us your ICP, we'll find them.

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Delivery within 24 hours · $1,250

⚠️ The exhibitor list for this event isn't publicly accessible yet. We'll work on it once you submit a request.

Organizer

Minalogic

Nonprofit · Grenoble, France · Founded 2005

An innovation cluster driving digital transformation and regional reindustrialization in the Auvergne-Rhône-Alpes region.

Runs 2 events → LinkedIn ↗

Why people attend

To discover emerging semiconductor/photonics technologies, view live demos, and network with RTO experts.

Exhibitor categories

SemiconductorsMicroelectronicsAICybersecurityAutomotiveHealthcare

Sample matches

Filtered to a Series-B SaaS ICP. Your filter will be different.

Sample Match A

example.com

91 — High
Enterprise SaaS200–500 employeesAmsterdam, NL

"Strong ICP match: Series B, EU expansion, VP Engineering and CTO attending."

Sample Match B

example.io

79 — Medium
Cloud platform50–200 employeesLondon, UK

"Mid-stage SaaS with active GTM motion; product-led growth signals align with ICP."

████████ ██████

████████.io

██ — Medium
████████████ 200–500 employees ████, ██

"████████████████████████████████████████."

Submit your ICP
to unlock all matches

Request intelligence →

████████ ██████

████████.io

██ — Medium
████████████ 200–500 employees ████, ██

"████████████████████████████████████████."

Submit your ICP
to unlock all matches

Request intelligence →

Speakers

465 speakers at LID World Summit

M

Manuel Le Gallo

Staff Research Scientist · IBM

"Memory for Edge Computing"

Bio

Manuel Le Gallo joined IBM Research Europe in 2013, where he is currently employed as a Staff Research Scientist in the In-Memory Computing group of the Zurich laboratory. His main research interest is in using phase-change memory devices for non-von Neumann computing. He has co-authored more than 50 scientific papers in journal and conferences and holds more than 20 granted patents. He was appointed IBM Master Inventor in 2019 for significant contributions to intellectual property and is a recipient of the MIT Technology Review's 2020 Innovators Under 35 award.

In-memory computingNeural network inferencePhase-change memory
M

"LID Taiwan"

LID Taiwan
B

Benoit Charbonnier

Research engineer · CEA-Leti

"Neuromorphic photonics for tomorrow’s AI"

Bio

Benoit Charbonnier received his engineering degree in 1994 from Ecole Nationale Supérieure des Télécommunications de Paris and received his Ph.D. degree in 1997 on 40 Gbps soliton transmission from the same institution. In 1997, he joined Nortel Network in Harlow, UK, in the Advanced Communications group where he worked on 80 Gbps long haul transmission and then, in 2001, joined Marconi Communications to develop an Ultra-Long Haul 10 Gb/s based transmission products. In 2004, he joined Orange Labs as a research engineer, focusing on next generation optical access networks and particularly on digital signal processing applied to optical communications. In 2015, he moved to CEA-Leti, Grenoble, leading the photonics program within the French Institute of Technology Nanoelec, developing industrial partnerships to promote silicon photonics technologies. He is now in charge of neuromorphic photonics applications within the silicon photonics lab.

neuromorphic photonicsAI computingsilicon photonics
V

Valentin Landmann

Head of Ecosystems Development · STMicroelectronics

"European ECOsystem for greeN Electronics (EECONE)"

Bio

Double master degree in France and Germany at Arts et Métiers (ENSAM) and Karlsruhe Institute of Technology (KIT) Diverse functions within the Tier-1 automotive manufacturer, ZF Group : Trainee Program (Friedrichshafen, Germany), project management in the field of Quality (Saarbrücken, Germany), European external affairs (Brussels, Belgium) Recently joined STMicrolectronics SAS as Head of Ecosystems Development (Paris, France)

E-waste managementCircular economySustainable electronics
S

Stefan Müller

enerix Alb-Bodensee, Filiale Radolfzell am Bodensee

"Memory for Edge Computing"

smart home energysolar energyenergy management

Also speaking at 13th International Conference on Distillation & Absorption, HAUS | BAU | ENERGIE Radolfzell, Solarplaza Summit Balkans

J

Johannes Müller

SMTS Global Technology & Development · GlobalFoundries

"Auto-Grade Embedded STT-MRAM: Enabling NVM for high reliability, harsh environment applications"

Bio

Dr. Müller is a Senior Member of Technical Staff in the TD Organization of GlobalFoundries and is currently driving next-generation MRAM stack development activities. Previously he was acting as the overall-integrator for the now qualified and ramped embedded 22FDX® STT-MRAM technology. Prior to joining GlobalFoundries Dr. Müller was heading the group for Non-Volatile Memories at Fraunhofer IPMS. Dr. Müller holds a diploma degree in Applied Natural Science from the Technical University Freiberg and a Ph.D. degree in Electrical Engineering from the Technical University of Dresden.

STT-MRAMAutomotive semiconductorsNon-volatile memory
H

Hitoshi Saito

Sr. Dir. of Sales & Marketing Div. / Dir. of Energing Memory Dept. · Fujitsu Semiconductor Memory Solution Limited

"Prospects and applications of FeRAM in the near future"

Bio

Hitoshi Saito joined Fujitsu Limited in 1990 after earning a bachelor's degree in electrical engineering from Tokyo University of Agriculture and Technology. He has been contributed in the development of DRAM, LOGIC, NAND, FeRAM, and NRAM. Since 2023 he has been Sr. Dir. of Sales & Marketing Div. / Dir. of Energing Memory Dept. at FUJITSU SEMICONDUCTOR MEMORY SOLUTION LIMITED. His recent interest is processes, devices and marketing in emerging memory. He has or had 23 patents on semiconductors. He is the author or co-author of 11 articles on FeRAM or NRAM.

FeRAM technologynonvolatile memorysemiconductor development
T

Tetsuro Higashi

Chairman of the Board of Directors · Rapidus Corp

"Mission of “Rapidus and LSTC” - Toward the Sustainable Growth of Leading-edge Semiconductor Industry in Japan"

Bio

TETSURO HIGASHI is the first Chairman of the Board of Directors at Rapidus Corporation, a company that researches, develops, designs, manufactures, and sells advanced logic semiconductors, in August 2022. Prior to this role, Higashi had held a series of executive roles at Tokyo Electron Limited from 1990 until 2019 when he resigned from his position at the company. After his experience as Vice President at the company’s Motorola Sales Department and the Diffusion Systems Department, and General Manager at the SPE 2 Division, he had joined the executive board as Corporate Director in 1990. Following that, he was appointed to President and CEO of the company starting from 1996 when he was 46 years old. He had become Chairman of the Board in 2003 and reappointed as President and CEO in a dual role in 2013. In 2016, he had was appointed Corporate Advisor and resigned from his position at the company in 2019. Mr. Higashi holds senior positions at several organizations related to semiconductor and technology including Directors Emeritus of SEMI (Semiconductor Equipment and Materials International) since 2012, Advisor of SEAJ (Semiconductor Equipment Association of Japan) since 2016, and Chairperson of the Executive Board of TIA since 2017. In addition, he was appointed to Chairman of Leading-edge Semiconductor Technology Center (LSTC), an organization that conducts next-generation semiconductor research, in 2023. Mr. Higashi was born on August 28, 1949, in Tokyo, Japan and received a B.A. (1973) in Social Science from International Christian University and a M.A. (1977) in Social Science from Tokyo Metropolitan University.

semiconductor industrynational securityadvanced logic semiconductors
A

Andrea Redaelli

PCM Process Architecture Technical Director - Fellow · STMicroelectronics

Bio

Andrea received the Laurea and Ph.D. degrees in electronic engineering from the Politecnico di Milano, Italy. During the Ph.D., he worked on Phase Change Memories in the Department of Electrical and Electronic Engineering (Politecnico di Milano), collaborating with the Non-Volatile Memory Technology Development Group of STMicroelectronics, Agrate Brianza. In 2007 he joined STMicroelectronics working on advanced technologies for Non-Volatile Memories. From 2008 to 2013 he worked as cell lead engineer on 45 and 28 nm PCM technology developments, firstly as a Numonyx employee and then joining Micron Technology. In the same years, Andrea cooperated with the Department of Electrical Engineering, Politecnico di Milano, in holding master classes on electronics and signal conditioning. From 2014 to March 2020, he worked on 3DXpoint technologies, in charge of the cell development at the most advanced scaled nodes. Since April 2020, Andrea is a fellow in STMicroelectronics, leading the cell development of embedded PCM technologies. Andrea is author and co-author of more than 60 papers and more than 130 granted US patents, resulting in a h-index of 29 according to google scholar.

Phase Change MemoryNon-Volatile MemorySemiconductor technology
R

Rémi Bastien

CEO · NextMove

"Electronics plays a growing role in the automobile"

Bio

Remi BASTIEN received his Engineer Diploma from ECAM in 1980. He joined RENAULT group in 1982, and after different responsibilities, he was Vice President for Research and Innovation for RENAULT Group (2009-15), before becoming Global Director for Autonomous Driving Prospective at the Renault/Nissan Alliance (2015-16) and finally Vice President, Automobile Prospective for RENAULT Group till 2021. He is honorary chairman of NEXT MOVE (French cluster dedicated to mobility), CTO of FISITA and member of the Shift Project (think tank for sustainable economy). He was member of the EUCAR council (former chairman in 2012) and Chairman of VEDECOM (French cooperative research institute) from 2017 to 2020, and Director of the program “Power Electronics” for French Automotive Industry and French Electronic Industry from 2020 to end of 2021. He is the co-author with Luc JULIA of the book “On va droit dans le mur?”.

automotive electronicscarbon neutralitycircular economy
K

Krysten Rochereau

Head of Technology & Design Platforms · STMicroelectronics

D

David Billon-Lanfrey

Chief Strategy Officer · LYNRED

F

Francis Deprez

Chair · PAB JU Chips Flanders Public Authority

S

Seamus Carroll

VP Semiconductors · IDA Ireland

A

Amandine Reix

Deputy Director, Spatial, Electronics & Software · DGE France

S

Sophie Giroud

Deputy head of MEMS laboratory · CEA-Leti

+ 449 more speakers at this event.

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Frequently asked questions

When is LID World Summit?+
LID World Summit takes place on 23 June 2026 to 25 June 2026.
Where is LID World Summit held?+
LID World Summit is held at Maison Minatec, Grenoble, FR.
Who organises LID World Summit?+
LID World Summit is organised by CEA-Leti.

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