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Manufacturing & Industrial
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Attendees
A specialized technical exhibition showcasing advanced packaging materials, assembly equipment, and testing solutions for semiconductors, ICs, and sensor manufacturing. It connects component producers with automotive and electronic hardware developers.
Exhibitor mix: Organized within the broader NEPCON Osaka co-located exhibitions, featuring specific zones for IC substrate materials, packaging design, molding/sealing equipment, and sensor assembly tech.
IC & Sensor Packaging Technology Expo Osaka is held annually. This page tracks the next confirmed edition — IC & Sensor Packaging Technology Expo Osaka 2028 dates will be added here once announced.
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268 exhibitors here. You probably care about 20–30. Tell us your ICP, we'll find them.
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Venue
INTEX OsakaExhibition centre · 72,932 m² · 6 halls
Major international exhibition and convention center located in Osaka, Japan. It is one of Japan's largest exhibition venues, featuring multiple large exhibition halls and meeting rooms, hosting a wide range of trade shows, exhibitions, and events.
📍 1-5-102, Nankokita, Suminoe-ku, Osaka 559-0034, Japan
Operated by INTEX Osaka Co., Ltd.
Organizer
RX Japan GKSubsidiary · Tokyo, Japan · Founded 1986
RX Japan organizes large-scale business-to-business trade shows and exhibitions across diverse industrial sectors.
Exhibitor list
268 companies are exhibiting at IC & Sensor Packaging Technology Expo Osaka. A sample of 12 is shown below — unlock the full list to see all 268.
Also exhibits at GREEN FACTORY Expo [September], 5th AUTOMOTIVE WORLD [September], NEPCON JAPAN - OSAKA
Also exhibits at ELECTROTEST JAPAN - OSAKA, GREEN FACTORY Expo Osaka, FINE PROCESS TECHNOLOGY EXPO OSAKA
Also exhibits at NEPCON JAPAN - OSAKA, PWB EXPO - Printed Wiring Boards Expo Japan (September Show), 5th AUTOMOTIVE WORLD [September]
Also exhibits at NEPCON JAPAN - OSAKA, GREEN FACTORY Expo Osaka, FINE PROCESS TECHNOLOGY EXPO OSAKA
Also exhibits at FINE PROCESS TECHNOLOGY EXPO - for Processing Technologies, ELECTROTEST JAPAN - Tokyo, NEPCON NAGOYA
Also exhibits at EV JAPAN - Exhibition for EV / HV / FCV Technology, ELECTROTEST JAPAN - OSAKA, 5th NEPCON JAPAN [September]
Also exhibits at 5th NEPCON JAPAN [September], NEPCON JAPAN – 41st Electronics R&D, Manufacturing and Packaging Technology Expo, IC & SENSOR PACKAGING EXPO JAPAN - NAGOYA
Also exhibits at NEPCON JAPAN - OSAKA, ELECTROTEST JAPAN - OSAKA, FINE PROCESS TECHNOLOGY EXPO OSAKA
Also exhibits at FINE PROCESS TECHNOLOGY EXPO OSAKA, Manufacturing World Nagoya, ELECTROTEST JAPAN - OSAKA
Also exhibits at IC & Sensor Packaging Expo, ELECTROTEST JAPAN - OSAKA, NEPCON JAPAN - OSAKA
Also exhibits at FINE PROCESS TECHNOLOGY EXPO OSAKA, FINE PROCESS TECHNOLOGY EXPO - for Processing Technologies, IC & Sensor Packaging Expo
Also exhibits at ELECTROTEST JAPAN - OSAKA, NEPCON JAPAN - OSAKA, GREEN FACTORY Expo Osaka
256 more exhibitors at IC & Sensor Packaging Technology Expo Osaka.
Unlock the complete exhibitor list — every company, with optional ICP filtering and verified buying-committee contacts per matched account.
Why people attend
Buyers attend to source next-generation packaging materials, evaluate automated assembly machinery, and establish partnerships to reduce semiconductor footprint and power consumption.
Who attends
Exhibitor categories
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Frequently asked questions