Events › Manufacturing & Industrial
Manufacturing & Industrial
450
Exhibitors
20,000
Attendees
A specialized exhibition focusing on final assembly, advanced equipment, materials, and technologies for integrated circuits (ICs) and semiconductor sensor packaging.
Attendees: Semiconductor, MEMS, and electronics manufacturers, along with engineers, R&D professionals, and specialists in advanced IC packaging and manufacturing services.
Exhibitor mix: Organized inside NEPCON Japan alongside specialised zones like Electrotest, Packaging, and Power Device Expo.
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Venue
Tokyo International Exhibition CenterExhibition centre · 115,420 m² · 16 halls
Japan's largest convention and exhibition center located in Koto-ku, Tokyo. Featuring extensive East, West, and South halls (115,420 sqm total indoor exhibition space), it hosts major trade shows, exhibitions, and conferences.
📍 3-11-1 Ariake, Koto-ku, Tokyo 135-0063, Japan
Operated by Tokyo Big Sight Inc.
Organizer
RX Japan GKSubsidiary · Tokyo, Japan · Founded 1986
RX Japan organizes large-scale business-to-business trade shows and exhibitions across diverse industrial sectors.
Exhibitor list
450 companies are exhibiting at IC & Sensor Packaging Expo. A sample of 12 is shown below — unlock the full list to see all 450.
Also exhibits at EV JAPAN - Exhibition for EV / HV / FCV Technology, PWB EXPO - PCBs/PWBs, PCB Materials, Design & Development Services, FINE PROCESS TECHNOLOGY EXPO - for Processing Technologies
Also exhibits at CAR-ELE JAPAN - International Car Electronics Technology Expo, ELECTROTEST JAPAN - Test in Electronics Manufacturing and R&D, EV JAPAN - Exhibition for EV / HV / FCV Technology
Also exhibits at 5th AUTOMOTIVE WORLD [September], PWB EXPO - PCBs/PWBs, PCB Materials, Design & Development Services, FINE PROCESS TECHNOLOGY EXPO - TOKYO
Also exhibits at International Electronic Components Trade Show, GREEN FACTORY Expo [September], ELECTROTEST JAPAN - Test in Electronics Manufacturing and R&D
Also exhibits at NEPCON JAPAN – 41st Electronics R&D, Manufacturing and Packaging Technology Expo, FINE PROCESS TECHNOLOGY EXPO - TOKYO, Automotive Lightweight Technology Expo
Also exhibits at GREEN FACTORY Expo [September], 5th AUTOMOTIVE WORLD [September], NEPCON JAPAN - OSAKA
Also exhibits at 5th AUTOMOTIVE WORLD [September], FINE PROCESS TECHNOLOGY EXPO - TOKYO, NEPCON JAPAN – 41st Electronics R&D, Manufacturing and Packaging Technology Expo
Also exhibits at Automotive Lightweight Technology Expo, PWB EXPO - Printed Wiring Boards Expo Japan (September Show), International Electronic Components Trade Show
Also exhibits at PWB EXPO - PCBs/PWBs, PCB Materials, Design & Development Services, NEPCON JAPAN – 41st Electronics R&D, Manufacturing and Packaging Technology Expo, International Electronic Components Trade Show
Also exhibits at FINE PROCESS TECHNOLOGY EXPO - for Processing Technologies, GREEN FACTORY Expo [September], ELECTROTEST JAPAN - Tokyo
Also exhibits at PWB EXPO - PCBs/PWBs, PCB Materials, Design & Development Services, SIFER, FINE PROCESS TECHNOLOGY EXPO - TOKYO
Also exhibits at FINE PROCESS TECHNOLOGY EXPO - TOKYO, CAR-ELE JAPAN Nagoya - Int'l Automotive Electronics Technology Expo Nagoya, EV JAPAN - Exhibition for EV / HV / FCV Technology
438 more exhibitors at IC & Sensor Packaging Expo.
Unlock the complete exhibitor list — every company, with optional ICP filtering and verified buying-committee contacts per matched account.
Why people attend
To source advanced semiconductor back-end processing equipment, inspect high-density circuit innovations, and establish partnerships with global packaging material suppliers.
Exhibitor categories
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Frequently asked questions