Events › Manufacturing & Industrial
Manufacturing & Industrial
An international trade exhibition specializing in integrated circuit (IC) final manufacturing, assembly equipment, packaging materials, and simulation software for advanced semiconductor development.
Exhibitor mix: The floor is arranged alongside concurrent co-located electronics manufacturing, smart factory, and automotive technology exhibitions under the Reed Exhibitions framework.
IC & Sensor Packaging Technology EXPO is held annually. This page tracks the next confirmed edition — IC & Sensor Packaging Technology EXPO 2027 dates will be added here once announced.
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224 exhibitors here. You probably care about 20–30. Tell us your ICP, we'll find them.
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Venue
Makuhari MesseMultipurpose · 72,000 m² · 11 halls · ~9,000 people
A major convention and exhibition complex in Chiba, Japan, comprising International Exhibition Halls 1-11, an International Conference Hall, and a 9,000-seat Event Hall. It hosts large-scale trade shows and concerts, with 72,000 sqm of total indoor exhibition space.
📍 2-1 Nakase, Mihama-ku, Chiba City, Chiba 261-8550, Japan
Operated by Makuhari Messe, Inc.
Organizer
RX Japan GKSubsidiary · Tokyo, Japan · Founded 1986
RX Japan organizes large-scale business-to-business trade shows and exhibitions across diverse industrial sectors.
Exhibitor list
224 companies are exhibiting at IC & Sensor Packaging Technology EXPO. A sample of 12 is shown below — unlock the full list to see all 224.
Also exhibits at 5th NEPCON JAPAN [September]
Also exhibits at EV JAPAN - Exhibition for EV / HV / FCV Technology, ELECTROTEST JAPAN - OSAKA, 5th NEPCON JAPAN [September]
Also exhibits at 5th NEPCON JAPAN [September], NEPCON JAPAN – 41st Electronics R&D, Manufacturing and Packaging Technology Expo, IC & SENSOR PACKAGING EXPO JAPAN - NAGOYA
Also exhibits at 5th NEPCON JAPAN [September], EV JAPAN - Exhibition for EV / HV / FCV Technology, FINE PROCESS TECHNOLOGY EXPO - TOKYO
Also exhibits at CAR-ELE JAPAN - International Car Electronics Technology Expo, EV JAPAN - Exhibition for EV / HV / FCV Technology, PWB EXPO - Printed Wiring Boards Expo Japan (September Show)
Also exhibits at Manufacturing World Tokyo, 5th NEPCON JAPAN [September]
Also exhibits at 5th NEPCON JAPAN [September]
Also exhibits at ELECTROTEST JAPAN - Test in Electronics Manufacturing and R&D, NEPCON JAPAN - OSAKA, International Electronic Components Trade Show
Also exhibits at ELECTROTEST JAPAN - Test in Electronics Manufacturing and R&D, IC & Sensor Packaging Expo, CAR-ELE JAPAN Nagoya - Int'l Automotive Electronics Technology Expo Nagoya
Also exhibits at FINE PROCESS TECHNOLOGY EXPO - for Processing Technologies, PWB EXPO - PCBs/PWBs, PCB Materials, Design & Development Services, ELECTROTEST JAPAN - Tokyo
Also exhibits at 5th NEPCON JAPAN [September]
Also exhibits at 5th NEPCON JAPAN [September], Smart Technology Expo, XXXII Międzynarodowe Targi Maszyn i Urządzeń dla Wodociągów i Kanalizacji WOD-KAN
212 more exhibitors at IC & Sensor Packaging Technology EXPO.
Unlock the complete exhibitor list — every company, with optional ICP filtering and verified buying-committee contacts per matched account.
Why people attend
To evaluate cutting-edge equipment, source packaging components, and compare backend technical services required to accelerate advanced IC and semiconductor module manufacturing processes.
Who attends
Exhibitor categories
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Past & future editions
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Frequently asked questions